SEMICON 2.0 Targets 200 Chip Design Startups: Vaishnaw
Union Minister for Electronics and Information Technology Ashwini Vaishnaw has outlined the next phase of India’s semiconductor push under SEMICON 2.0, saying the programme will target at least 200 startups and companies designing chips in India across a broad range of semiconductor requirements.
The six pillars that are building the next phase of India’s semiconductor journey. 🇮🇳
— Ashwini Vaishnaw (@AshwiniVaishnaw) September 17, 2026
Design | Machines & Materials | More Fabs | ATMP/OSAT Industry | R&D | Talent
📍SEMICON India 2026 pic.twitter.com/JCRyjZZcy8
Speaking at SEMICON India 2026 in New Delhi, Vaishnaw said chip design will be a key pillar of SEMICON 2.0. He noted that 105 startups had participated in the first phase, with around 20 securing venture capital funding of about ₹800 crore.
Chips ‘Made in India’… for the World! pic.twitter.com/pEioBMg5gB
— Ashwini Vaishnaw (@AshwiniVaishnaw) September 17, 2026
The Minister said the second pillar will focus on semiconductor machines and materials, including equipment, chemicals and other inputs required for manufacturing. He also highlighted the $5 billion investment announced at the event, saying it would contribute to employment generation in India. Applied Materials separately announced a $5 billion investment in India over the next decade.
SEMICON 2.0 was approved by the Union Cabinet in July 2026 with a total outlay of ₹1,27,500 crore, covering six pillars aimed at strengthening India’s semiconductor design, manufacturing, packaging, research and talent ecosystem.
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